■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 1–1)
■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers
■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters
■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity
■ Programmable Power Technology, which minimizes power while maximizing device performance
■ Selectable Core Voltage, available in low-voltage devices (L ordering code suffix), enables selection of lowest power or highest performance operation
■ Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device
■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting
■ Memory interface support with dedicated DQS logic on all I/O banks
■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks